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4 Inch High Purity Semi-Insulating HPSI SiC pindho sisih polesan wafer Substrat
  • 4 Inch High Purity Semi-Insulating HPSI SiC pindho sisih polesan wafer Substrat4 Inch High Purity Semi-Insulating HPSI SiC pindho sisih polesan wafer Substrat
  • 4 Inch High Purity Semi-Insulating HPSI SiC pindho sisih polesan wafer Substrat4 Inch High Purity Semi-Insulating HPSI SiC pindho sisih polesan wafer Substrat

4 Inch High Purity Semi-Insulating HPSI SiC pindho sisih polesan wafer Substrat

Semicorex nyedhiyakake macem-macem jinis wafer 4H lan 6H SiC. Kita wis dadi produsen lan supplier substrat wafer sajrone pirang-pirang taun. 4 Inch High Purity Semi-Insulating HPSI SiC Double-side Polished Wafer Substrat duweni kauntungan rega sing apik lan nutupi sebagian besar pasar Eropa lan Amerika. We look nerusake kanggo dadi partner long-term ing China.

Kirim Pitakonan

Deskripsi Produk

Semicorex duwe garis produk wafer silikon karbida (SiC), kalebu substrat 4H lan 6H kanthi wafer semi-insulating tipe-N, P-jinis lan kemurnian dhuwur, bisa nganggo utawa tanpa epitaksi.

Ngenalke 4 Inch High Purity Semi-Insulating HPSI SiC Double-side Polished Wafer Substrat, produk paling dhuwur sing dirancang kanggo nyukupi kabutuhan aplikasi elektronik lan semikonduktor canggih.

4 Inch High Purity Semi-Insulating HPSI SiC Double-side Polished Wafer Substrat utamane digunakake ing komunikasi 5G, sistem radar, kepala panuntun, komunikasi satelit, pesawat tempur lan lapangan liyane, kanthi kaluwihan nambah jangkauan RF, jarak ultra-panjang. identifikasi, anti-jamming lan kacepetan dhuwur, transfer informasi kapasitas dhuwur lan aplikasi liyane, dianggep landasan paling becik kanggo nggawe piranti daya gelombang mikro.


Spesifikasi:

● Dhiameter: 4″

● pindho polesan

●l Kelas: Produksi, Riset, Dummy

● 4H-SiC HPSI Wafer

● Ketebalan: 500±25 μm

●l Kapadhetan Micropipe: ≤1 ea/cm2~ ≤10 ea/cm2


barang

Produksi

Riset

goblok

Parameter kristal

Polytype

4H

Orientasi lumahing ing sumbu

<0001 >

Orientasi lumahing off-axis

0±0.2°

(0004)FWHM

≤45arcsec

≤60arcsec

≤1OOarcsec

Parameter Listrik

Jinis

HPSI

Resistivity

≥1 E9ohm·cm

100% area > 1 E5ohm·cm

70% area > 1 E5ohm·cm

Parameter Mekanik

Dhiameter

99,5 - 100 mm

kekandelan

500±25 μm

Orientasi flat utama

[1-100]±5°

Dawane warata utami

32,5 ± 1,5 mm

Posisi flat sekunder

90° CW saka flat primer ±5°. silikon pasuryan munggah

Dawane flat sekunder

18 ± 1,5 mm

TTV

≤5 μm

≤10 μm

≤20 μm

LTV

≤2 μm (5mm * 5mm)

≤5 μm (5mm * 5mm)

sing

gandhewo

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Warp

≤20 μm

≤45 μm

≤50 μm

Kekasaran ngarep (Si-wajah) (AFM)

Ra≤0.2nm (5μm*5μm)

Struktur

Kapadhetan micropipe

≤1 ea/cm2

≤5 ea/cm2

≤10 ea/cm2

Kapadhetan inklusi karbon

≤1 ea/cm2

sing

Kekosongan heksagonal

ora ana

sing

Kotoran logam

≤5E12atom/cm2

sing

Kualitas ngarep

Ngarep

lan

Rampung lumahing

Si-face CMP

partikel

≤60ea/wafer (ukuran≥0.3μm)

sing

Goresan

≤2ea/mm. Dawane kumulatif ≤Diameter

Kumulatif dawa≤2 * Diameter

sing

Kulit jeruk / pit / noda / striations / retak / kontaminasi

ora ana

sing

Pinggir chip / indents / fraktur / piring hex

ora ana

Wilayah politipe

ora ana

Area kumulatif≤20%

Area kumulatif≤30%

Tandha laser ngarep

ora ana

Kualitas mburi

Rampung mburi

C-pasuryan CMP

Goresan

≤5ea/mm, Kumulatif length≤2 * Diameter

sing

Cacat mburi (keripik pinggir / indentasi)

ora ana

Kasar mburi

Ra≤0.2nm (5μm*5μm)

Tandha laser mburi

1 mm (saka pinggir ndhuwur)

Pinggir

Pinggir

Chamfer

Kemasan

Kemasan

Kanthong njero diisi nitrogen lan kantong njaba disedot.

Kaset multi-wafer, epi-siap.

* Cathetan: "NA" tegese ora ana panjaluk.




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Kirim Pitakonan
Mangga bebas menehi pitakon ing formulir ing ngisor iki. Kita bakal mangsuli sampeyan ing 24 jam.
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